MediaTek is set to announce the Dimensity 9400 in October 2024. Recent reports suggest that this new platform for high-end phones will be much more efficient than the Dimensity 9300. On Monday (26), leaker Digital Chat Station revealed new details about the chipset.
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The tipster claims that the Dimensity 9400 could be 30% faster than the Snapdragon 8 Gen 3. It might also use 40% less power, according to 3DMark benchmark tests. However, there are no specific details on how it will compare to the Snapdragon 8 Gen 4. The Snapdragon 8 Gen 4 will be the main competitor to MediaTek’s new chipset.
The Dimensity 9400’s performance and power efficiency boost could be attributed in large part to TSMC’s new “second-generation” 3nm lithography. Additionally, the 8-core CPU is expected to include only high-performance cores. This feature will be similar to the Snapdragon 8 Gen 4.
However, speculation suggests that the Dimensity 9400 will base its CPU on a new Arm design called “Blackhawk.”. Leakers claim that these cores will deliver more instructions per clock. This performance will surpass that of the Oryon CPU in the Snapdragon 8 Gen 4.
Rumors suggest that the Dimensity 9400 will have a large die with 30 billion transistors and an area of 150 mm². A larger die size would allow for more cache in the SoC and better temperature distribution. This could enhance performance under stress.
MediaTek CEO Rick Tsai recently mentioned that he expects a 50% revenue increase year-over-year in 2023, potentially due to the Dimensity 9400. Experts anticipate high demand for this chipset. This is especially due to the potential rise in prices of smartphones with the Snapdragon 8 Gen 4.
MediaTek Dimensity 9400 Will Have Great Efficiency and a CPU Up to 30% Better Than Its Predecessor
MediaTek will announce the Dimensity 9400 in October as its new high-end platform for mobile devices. It is designed to power rugged smartphones and tablets in the coming months. To compete with Qualcomm’s Snapdragon 8 Gen 4, which will offer a significant performance boost with its Oryon cores, MediaTek’s new chip will also feature notable improvements. These improvements will be in both performance and efficiency.
According to well-known leaker Digital Chat Station on Weibo, the Dimensity 9400 will see around a 35% improvement in energy efficiency compared to the Dimensity 9300. Additionally, experts expect single-core performance to increase by about 30%.
The performance and efficiency gains could be so significant that the Dimensity 9400 might deliver the same performance as the Snapdragon 8 Gen 3. It could use only 30% of the power, resulting in 70% less battery consumption. With the Snapdragon 8 Gen 4 showing a similar 30% performance improvement over its predecessor in recent tests, MediaTek could achieve a notable advantage in CPU performance. This would be with its next-generation chip.
It’s still too early to say if the Dimensity 9400 will outperform the Snapdragon 8 Gen 4, as both chips will only be released in October. However, recent years have shown a close competition between Qualcomm and MediaTek for top-tier performance, with MediaTek gaining significant market share. Analysts expect the company to see a 50% increase in annual revenue this year.
While the Dimensity 9400 shows promising improvements in CPU performance and energy efficiency in internal tests, we need to see how these platforms perform in real-world use. Additionally, tests on GPU and NPU performance will be important, as Qualcomm has excelled in these areas in recent generations. With increasing focus on Artificial Intelligence applications, this could be a crucial factor for smartphone manufacturers when choosing a chip.
We do not yet have the exact launch date for the Dimensity 9400, but MediaTek will likely announce it in October. Qualcomm will also announce the Snapdragon 8 Gen 4 on October 21. This makes October an exciting month for mobile technology enthusiasts.
