Rumors abound that Intel is eyeing TSMC’s 2-nanometer process for its upcoming “Nova Lake” CPU lineup, touted to herald the biggest architectural shift in the company’s history. Meanwhile, TSMC has already piqued the interest of several clients, including Apple, for its 2-nanometer technology, slated for production in 2025.
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Intel’s Move and TSMC’s Appeal
In a bid to stay competitive against the strides made by AMD and Apple in the processor market, Intel is reportedly banking on TSMC’s 2-nanometer process. This strategic shift comes as Intel’s own foundry services lag behind in offering cutting-edge processes.
Nova Lake’s Promise
Intel aims to unleash the Nova Lake chips in 2026, boasting a 50% performance boost over the yet-to-be-released Lunar Lake generation. While specifics about the Nova Lake CPU remain scarce, speculation suggests significant architectural changes may be in the works.
Apple’s Interest and Future Plans
Rumor has it that Apple has secured the entire initial batch of 2-nanometer wafers from TSMC, possibly earmarking this technology for the potent chipset slated to power the Pro and Pro Max variants of the iPhone 17 lineup. This unveiling is expected in the final quarter of next year, emphasizing performance and energy efficiency.
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Long-standing Partnership and Market Impact
Apple’s longstanding partnership with TSMC positions the tech giant as a top priority for the Taiwanese manufacturer. Market sources indicate that Apple will be TSMC’s “initial customer,” with chip shipments anticipated in the latter half of 2025.
Continued Innovation
In 2023, Apple adopted TSMC’s 3-nanometer chips for its iPhones and Macs, with the A17 Pro chip in the iPhone 15 Pro models and the M3 series chips in Macs all crafted using TSMC’s 3-nanometer process.
This potential collaboration between Apple, Intel, and TSMC underscores the ongoing race for technological supremacy in the semiconductor industry, with each player vying for a strategic advantage in the ever-evolving landscape.
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