The Exynos 2400 is being mass-produced on Samsung’s enhanced 4LPP+ architecture, bringing significant improvements in energy efficiency compared to the giant South Korean’s previous chipsets. Recent rumors suggest, however, that Samsung’s yields are below those of TSMC, despite the increase to 60%, a notable improvement over the disappointing 25% from a year ago. The information comes from user Revegnus, in a post on X.
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Although still behind TSMC, Samsung has shown considerable progress, mainly with the implementation of Fan-out Wafer Level Packaging technology, known by the acronym FOWLP, in the Exynos 2400. This innovation improves heat transfer, explaining the respectable temperatures even during intensive tests.
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There is potential for Samsung to further improve its yields, but even keeping them at 60%, the company has significantly enhanced the Exynos 2400, allowing investments in next-generation lithography. This 4LPP+ manufacturing process can be extended to the Google Tensor G4, offering similar attributes, although uncertainty remains about possible yield improvements.
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Although the Exynos 2400 still lags behind the Snapdragon 8 Gen 3 in some tests, the performance difference has decreased considerably, showing that Samsung has production capacity to compete more effectively. The Exynos 2500, Samsung’s possible next flagship silicon, may adopt the 3nm GAA process, seeking to surpass TSMC’s technological innovations. Changes may occur by 2024, and we will keep our readers updated.
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